Ka-Ro TXMP2
TX Family · SO-DIMM (DIMM200) · 67.6mm × 26mm × 4mm
Overview
The TXMP2 is a security-focused System on Module built on the STM32MP255 processor with Dual Cortex-A35 cores and a Cortex-M33 co-processor. Featuring SESIP Level 3 certification, TrustZone on both A and M cores, and robust hardware encryption, it is designed for applications where security is paramount. The integrated Vivante NPU delivers 1.35 TOPS of AI inference capability, while 3D GPU support for OpenGL ES 3.1, Vulkan 1.1, and OpenCL 1.2 enables rich graphical interfaces. With a 10-year longevity program, 100% operating time over 10 years, and an extended industrial temperature range of −40°C to 85°C, the TXMP2 is built for long-lifecycle embedded deployments.
Key Features
STM32MP255 Processor
Dual Cortex-A35 @ 1.5 GHz application cores with Cortex-M33 @ 400 MHz real-time co-processor for mixed-criticality workloads.
Hardware Security
SESIP Level 3 certified with TrustZone on both A and M cores and robust hardware encryption for secure-by-design applications.
AI/ML Accelerator
Integrated Vivante NPU delivering 1.35 TOPS for on-device AI inference at the edge without cloud dependency.
Advanced 3D Graphics
RGB display interface with 3D GPU supporting OpenGL ES 3.1, Vulkan 1.1, OpenCL 1.2, and 1080p60 video output.
10-Year Longevity
100% operating time over 10 years with a dedicated 10-year longevity program, ensuring long-term availability and support.
Extended Temperature Range
Industrial-grade operation from −40°C to 85°C with 5V ±10% supply for reliable deployment in extreme environments.
Connectivity
Ethernet
2x (10/100 + Gb RGMII)
USB
2x USB 2.0 + PCIe or 1x USB 2.0 + 1x USB 3.0
UART
Up to 9x UART
I2C
8x I2C
SPI
8x SPI
CAN
3x FlexCAN
Camera
MIPI-CSI 2-lane
Storage
eMMC / SD
I/O Voltage
3.3V
Available Variants
| Feature | TXMP2 |
|---|---|
| Processor | STM32MP255 |
| CPU Cores | Dual Cortex-A35 @ 1.5 GHz |
| Co-Processor | Cortex-M33 @ 400 MHz |
| RAM | 1GB LPDDR4 |
| Storage | 4GB eMMC |
| GPU | 3D GPU (OpenGL ES 3.1, Vulkan 1.1, OpenCL 1.2) |
| AI/ML | Vivante NPU, 1.35 TOPS |
| Security | SESIP Level 3, TrustZone (A + M cores), HW encryption |
| Display | RGB Interface, 1080p60 |
| Longevity | 100% operating time, 10-year program |
| OS Support | Linux |
Design Advantages
Pin-Compatible TXCOM
The TXMP2 follows the TXCOM standard, ensuring pin compatibility across the entire TX module family for seamless hardware upgrades and scalability.
Compact SO-DIMM
The DIMM200 SO-DIMM form factor (67.6mm × 26mm × 4mm) enables space-efficient integration in compact embedded designs.
Integrated Power & Peripherals
Onboard power management, memory, storage, and comprehensive peripheral interfaces reduce carrier board complexity and accelerate time-to-market.
Industrial Longevity
Built for long product lifecycles with industrial-grade components rated for −40°C to 85°C and a 10-year longevity program ensuring sustained availability.
Electrical Characteristics
| Parameter | Value |
|---|---|
| Supply Voltage | 5V ±10% |
| I/O Voltage | 3.3V |
| Operating Temperature | −40°C to 85°C (Industrial) |
| Form Factor | SO-DIMM DIMM200 |
| Dimensions | 67.6mm × 26mm × 4mm |
| Memory | 1GB LPDDR4 |
| Storage | 4GB eMMC |
| Security Certification | SESIP Level 3 |
| Design Lifetime | 100% operating time, 10-year longevity program |
Documentation
Download the TXMP2 datasheet for full technical specifications, pinout details, and integration guidelines.
Download Datasheet (PDF)