Overview
The QSXP is a QFN-style solder-down Computer-on-Module from Ka-Ro electronics, part of the QSX extended family. Measuring 29mm square with a total height of 2.6mm, the QSXP is the highest-performance module in the QS/QSX family, based on the NXP i.MX 8M Plus with quad Cortex-A53 cores at 1.6 GHz and a Cortex-M7 co-processor at 800 MHz. Featuring a 2.3 TOPS Neural Network Accelerator, dual camera ISP, USB 3.0, PCIe Gen 3, and 2GB LPDDR4 RAM, it delivers maximum AI and multimedia performance in the 108-pad QFN solder-down format.
Key Features
Processor
NXP i.MX 8M Plus
Quad ARM Cortex-A53 @ 1.6 GHz + Cortex-M7 @ 800 MHz
Memory
2GB LPDDR4 RAM
8GB eMMC Flash
Temperature Range
Industrial Grade
-30°C to +85°C
Form Factor
29 x 29 x 2.6 mm
QFN style, 108 pads, 1mm pitch
AI / NPU
2.3 TOPS Neural Network Accelerator
HiFi4 DSP @ 800 MHz
OS Support
Linux
Ready for application development
Connectivity
Available Variants
| Feature | QS8M | QSXM | QSXP |
|---|---|---|---|
| Processor | i.MX 8M Mini | i.MX 8M Plus | |
| Primary Core | 4x Cortex-A53 @ 1.6 GHz | ||
| Secondary Core | Cortex-M4 @ 400 MHz | Cortex-M7 @ 800 MHz | |
| RAM | 1 GB DDR3L | 2 GB LPDDR4 | 2 GB LPDDR4 |
| ROM | 4 GB eMMC | 8 GB eMMC | |
| GPU | GCNanoUltra | GC7000UL (OpenGL ES 3.1, Vulkan) | |
| AI / ML | - | 2.3 TOPS NPU + HiFi4 DSP | |
| Video | 1080p60 H.264 | 1080p60 H.264/H.265 | |
| USB | 2x USB 2.0 | 2x USB 2.0, PCIe | USB 2.0, USB 3.0, PCIe Gen 3 |
| Camera | 4-lane MIPI-CSI | Dual 4-lane MIPI-CSI + ISP | |
| Form Factor | 100 pads, 27mm | 108 pads, 29mm | 108 pads, 29mm |
| Temperature | -25°C to +85°C | -30°C to +85°C | |
| Order Code | QS8M/MQ/1GS/4GF/E85 | QSXM/MM6C/2GS/4GF/E85 | QSXP/ML8C/2GS/8GF/E85 |
Design Advantages
Solder-Down Design
QFN-style module with thermal pad for excellent thermal performance and defined ground plane connection for all signals. Visual solder joint inspection possible after assembly.
Easy PCB Integration
High-speed design compliant. Even 2-layer PCBs can be used thanks to the large ground pad providing a solid ground plane for controlled impedance routing.
EMI Performance
Large ground pad on bottom side provides a defined return path for all signals, minimising loop area and reducing radiation and EMI issues.
Industrial Reflow Compatible
Compatible with industrial standard reflow profile for Pb-free solders. Single-sided assembly with standard contact assignments.
Electrical Characteristics
| Parameter | Min | Max |
|---|---|---|
| Power Supply (VIN) | 3.3V | 5V |
| Maximum Current | - | - |
| Power Supply Rating | - | - |
| Operating Temperature | -30°C | +85°C |
Documentation
Download the full QSXP datasheet for complete specifications, pinout details, and design guidelines.
Download Datasheet (PDF)