TXRZ

€0,00

Description

The QSMP series are compact, QFN-style solder-down Computer-on-Modules from Ka-Ro electronics, designed for industrial embedded applications. Key advantages include:

  • Ultra-compact QFN package with thermal pad
  • Visual solder joint inspection after assembly
  • Single-sided PCB assembly
  • QS family pin-compatible design
  • Industrial temperature range
  • 3.3V power supply
  • Linux OS support

Scroll down for detailed specifications, connectivity options, and variant information for this specific module.

Overview

The TXRZ is a SO-DIMM Computer-on-Module from Ka-Ro electronics, part of the TX Family. Using the standard DIMM200 connector in a compact 67.6mm x 26mm x 4mm form factor, the TXRZ combines the Renesas RZ/G2L dual Cortex-A55 processor with a Cortex-M33 real-time core, delivering high-performance multimedia processing for industrial HMI, IoT gateways, and embedded vision applications. With an integrated Mali-G31 GPU and H.264 video codec, the TXRZ is particularly suited to applications requiring rich graphical interfaces and video processing in an industrially rugged, long-life platform.

Key Features

Processor

Renesas RZ/G2L
2x Cortex-A55 @ 1.2 GHz
1x Cortex-M33 @ 200 MHz

Memory

512MB / 1GB DDR3L RAM
4GB eMMC Flash

Temperature Range

Industrial Grade
-40°C to +85°C

Form Factor

67.6 x 26 x 4 mm
SO-DIMM (DIMM200 connector)

Display & Graphics

RGB / LVDS + MIPI-DSI
500 MHz Mali-G31 GPU
H.264 Video Codec

OS Support

Linux
Ready for application development

Connectivity

10/100 Ethernet
RGMII Ethernet
USB (x2)
CAN Bus (x2)
UART (x4)
I2C (x4) / SPI (x3)
SAI Audio
MIPI-CSI Camera

Available Variants

FeatureTXRZ
ProcessorRenesas RZ/G2L
Primary Core2x Cortex-A55 @ 1.2 GHz
Secondary Core1x Cortex-M33 @ 200 MHz
RAM512 MB / 1 GB DDR3L
ROM4 GB eMMC
DisplayRGB / LVDS + MIPI-DSI
GPU500 MHz Mali-G31
Video CodecH.264 Encode / Decode
CAN2x CAN
Temperature-40°C to +85°C

Design Advantages

Pin-Compatible TXCOM Design

Standard TXCOM pinout across the TX Family enables a scalable platform strategy. Design one baseboard and migrate between processors as application requirements evolve.

Compact SO-DIMM Form Factor

At just 26mm wide and credit-card sized, the DIMM200 SO-DIMM connector provides a compact, socketed solution that can be replaced or upgraded in the field without soldering.

Integrated Power & Peripherals

Onboard Ethernet PHY, USB PHY, and PMIC reduce baseboard complexity and BOM cost. Simply supply 3.3V to 5V and connect your application peripherals.

Industrial Longevity

Industrial-grade components rated for -40°C to +85°C extended temperature operation with long-term availability commitment, ensuring your product design remains in production for years.

Electrical Characteristics

ParameterMinMax
Power Supply (VIN)3.3V5.0V
I/O Voltage-3.3V
Display Pixel Clock20 MHz68 MHz
Operating Temperature-40°C+85°C

Documentation

Download the full TXRZ datasheet for complete specifications, pinout details, and design guidelines.

Download Datasheet (PDF)

Payment & Security

Payment methods

  • PayPal

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TXRZ

€0,00
RENESAS RZ/G2L 1.2 GHz Dual Cortex®-A55
512MB/1GB DDR3L, 4GB eMMC
-40 °C to 85 °C
68 x 26 x 4 mm
Datasheet
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