Overview
The Ka-Ro TXUL is a power-efficient Computer-on-Module (CoM) in the TX family, built around the NXP i.MX6 UltraLite (MCIMX6G2) Cortex-A7 processor. Designed in the compact SO-DIMM form factor (26mm width), the TXUL combines low power consumption with versatile connectivity including dual Ethernet, dual USB, and FlexCAN interfaces. With flexible power input from 3.1V to 5.5V (compatible with Li-Ion, USB, AC adapter, or 3.3V supply), ARM TrustZone security, and an industrial temperature range of -40°C/-25°C to 85°C, the TXUL is ideal for cost-sensitive industrial and IoT applications running Linux or Windows Embedded Compact 7.
Key Features
Ultra-Low Power Cortex-A7
NXP i.MX6 UltraLite Cortex-A7 at 528 MHz with NEON SIMD, VFP, and 128KB L2 cache delivers efficient processing for power-constrained designs.
ARM TrustZone Security
Hardware-isolated TrustZone with crypto engine supporting AES, TDES, and SHA, plus secure boot for robust firmware protection.
Flexible Power Input
Wide 3.1V to 5.5V supply range supports Li-Ion battery, USB, AC adapter, or regulated 3.3V, simplifying power design.
Dual 10/100 Ethernet
Two independent 10/100 Ethernet interfaces enable network redundancy, bridging, or simultaneous IT/OT network connectivity.
LCD Display with PXP
24bpp LCD TFT output with a dedicated Pixel Processing Pipeline (PXP) for hardware-accelerated image compositing and scaling.
Industrial Temperature Range
Available in -40°C to 85°C and -25°C to 85°C variants, ensuring reliable operation across harsh industrial environments.
Connectivity
Available Variants
| Variant | Processor | CPU Clock | RAM | Storage | Temp. Range |
|---|---|---|---|---|---|
| TXUL (NAND) | i.MX6 UltraLite (MCIMX6G2) | 528 MHz | 256MB DDR3 | 128MB NAND Flash | -40°C/-25°C to 85°C |
| TXUL (eMMC) | i.MX6 UltraLite (MCIMX6G2) | 528 MHz | 256MB DDR3 | 4GB eMMC | -40°C/-25°C to 85°C |
Design Advantages
Pin-Compatible TXCOM Design
The TXUL follows the TXCOM standard pinout, enabling drop-in replacement and seamless migration between TX family modules without baseboard redesign.
Compact SO-DIMM Form Factor
The standard SO-DIMM connector simplifies baseboard design and enables compact system integration with a proven mechanical interface.
Flexible Power Input
Wide 3.1V to 5.5V supply voltage accepts Li-Ion batteries, USB power, AC adapters, or regulated 3.3V, reducing power supply complexity.
Industrial Longevity
Long-term availability and industrial-grade components ensure reliable supply and performance throughout the product lifecycle.
Electrical Characteristics
| Parameter | Value |
|---|---|
| Supply Voltage | 3.1V to 5.5V (Li-Ion, USB, AC adapter, 3.3V) |
| I/O Voltage | 3.3V |
| Security | Crypto Engine (AES / TDES / SHA), Secure Boot |
| CPU Extensions | ARM TrustZone, NEON, VFP |
| L2 Cache | 128KB |
| Operating Temperature | -40°C/-25°C to 85°C |
| Form Factor | SO-DIMM, 26mm width |
| OS Support | Windows Embedded Compact 7, Linux |
Documentation
Download the full TXUL datasheet for detailed specifications, pinout diagrams, and integration guidelines.
Download Datasheet (PDF)