Overview
The Ka-Ro TX6 is a high-performance Computer-on-Module (CoM) in the TX family, powered by the NXP i.MX6 Solo Cortex-A9 processor running at 800 MHz. Built in the SO-DIMM form factor (31mm width), the TX6 delivers Full HD multimedia capabilities with OpenGL ES 2.0 GPU, 1080p60 video decode, and dual LVDS display support. With up to 512MB DDR3 RAM, flexible 3.1V to 5.5V power input, PCIe 2.0 connectivity, and an extended industrial temperature range up to 105°C Tj, the TX6 serves demanding applications across Linux, Android, Windows Embedded, and QNX.
Key Features
High-Performance Cortex-A9
NXP i.MX6 Solo Cortex-A9 at 800 MHz with NEON MPE, dual single-precision floating point, and 1MB L2 cache for demanding applications.
Full HD Multimedia
OpenGL ES 2.0 GPU with Full HD 24bpp LCD, 1080p60 video decode and 1080p30 encode for rich multimedia and HMI applications.
Dual LVDS Display
LVDS variant supports dual LVDS output for high-resolution industrial panels, enabling advanced display configurations.
PCIe 2.0 Expansion
Single-lane PCIe 2.0 interface enables high-bandwidth expansion for Wi-Fi, SSD, or custom FPGA acceleration.
Multi-OS Support
Runs Windows Embedded Compact 7, WEC 2013, Linux, Android, and QNX, providing maximum flexibility for any software ecosystem.
Extended Temperature Range
Industrial-rated operation from -40°C/-25°C to 105°C Tj ensures reliability in extreme thermal environments.
Connectivity
Available Variants
| Variant | Processor | CPU Clock | RAM | Storage | Temp. Range |
|---|---|---|---|---|---|
| TX6 (256MB / NAND) | i.MX6 Solo | 800 MHz | 256MB DDR3 | 128MB NAND Flash | -40°C/-25°C to 105°C Tj |
| TX6 (256MB / eMMC) | i.MX6 Solo | 800 MHz | 256MB DDR3 | 4GB eMMC | -40°C/-25°C to 105°C Tj |
| TX6 (512MB / NAND) | i.MX6 Solo | 800 MHz | 512MB DDR3 | 128MB NAND Flash | -40°C/-25°C to 105°C Tj |
| TX6 (512MB / eMMC) | i.MX6 Solo | 800 MHz | 512MB DDR3 | 4GB eMMC | -40°C/-25°C to 105°C Tj |
Design Advantages
Pin-Compatible TXCOM Design
The TX6 follows the TXCOM standard pinout, enabling drop-in replacement and seamless migration between TX family modules without baseboard redesign.
Compact SO-DIMM Form Factor
The standard SO-DIMM connector simplifies baseboard design and enables compact system integration with a proven mechanical interface.
Integrated Power & Peripherals
Wide 3.1V to 5.5V input with onboard regulation and rich integrated peripherals reduce baseboard complexity and BOM cost.
Industrial Longevity
Long-term availability and industrial-grade components ensure reliable supply and performance throughout the product lifecycle.
Electrical Characteristics
| Parameter | Value |
|---|---|
| Supply Voltage | 3.1V to 5.5V |
| I/O Voltage | 3.3V |
| CPU Extensions | NEON MPE, Dual Single-Precision FP |
| L2 Cache | 1MB |
| GPU | OpenGL ES 2.0 |
| Video Decode | HD 1080p60 |
| Video Encode | HD 1080p30 |
| Operating Temperature | -40°C/-25°C to 105°C Tj |
| Form Factor | SO-DIMM, 31mm width |
| OS Support | WEC 7, WEC 2013, Linux, Android, QNX |
Documentation
Download the full TX6 datasheet for detailed specifications, pinout diagrams, and integration guidelines.
Download Datasheet (PDF)