TX93

€0,00

Description

The QSMP series are compact, QFN-style solder-down Computer-on-Modules from Ka-Ro electronics, designed for industrial embedded applications. Key advantages include:

  • Ultra-compact QFN package with thermal pad
  • Visual solder joint inspection after assembly
  • Single-sided PCB assembly
  • QS family pin-compatible design
  • Industrial temperature range
  • 3.3V power supply
  • Linux OS support

Scroll down for detailed specifications, connectivity options, and variant information for this specific module.

Overview

The TX93 is a SO-DIMM Computer-on-Module from Ka-Ro electronics, part of the TX Family. Using the standard DIMM200 connector in a compact 67.6mm x 26mm x 4mm form factor, the TX93 delivers dual-core Arm Cortex-A55 processing at 1.5 GHz alongside a Cortex-M33 real-time core, making it ideal for industrial IoT, edge AI, and vision applications. The module features NXP’s i.MX 93 processor with an integrated Arm Ethos U-65 microNPU for machine learning inference at the edge, plus the EdgeLock secure enclave for hardware-rooted security.

Key Features

Processor

NXP i.MX 93
2x Cortex-A55 @ 1.5 GHz
1x Cortex-M33 @ 250 MHz

Memory

1GB LPDDR4 RAM
4GB eMMC Flash

Temperature Range

Industrial Grade
-25°C to +85°C

Form Factor

67.6 x 26 x 4 mm
SO-DIMM (DIMM200 connector)

Display & Vision

LVDS + MIPI-DSI
2D GPU, MIPI-CSI (4-lane)
Arm Ethos U-65 microNPU

OS Support

Linux
Ready for application development

Connectivity

2x Ethernet
USB 2.0 (x2)
CAN-FD (x2)
UART (x8)
I2C (x7) / SPI (x8)
SAI Audio
eMMC / SD Card
MIPI-CSI Camera

Available Variants

FeatureTX93
ProcessorNXP i.MX 93
Primary Core2x Cortex-A55 @ 1.5 GHz
Secondary Core1x Cortex-M33 @ 250 MHz
RAM1 GB LPDDR4
ROM4 GB eMMC
DisplayLVDS + MIPI-DSI
GPU / NPU2D GPU + Arm Ethos U-65 microNPU
CAN2x CAN-FD
SecurityNXP EdgeLock Secure Enclave
Temperature-25°C to +85°C

Design Advantages

Pin-Compatible TXCOM Design

Standard TXCOM pinout across the TX Family enables a scalable platform strategy. Design one baseboard and migrate between processors as application requirements evolve.

Compact SO-DIMM Form Factor

At just 26mm wide and credit-card sized, the DIMM200 SO-DIMM connector provides a compact, socketed solution that can be replaced or upgraded in the field without soldering.

Integrated Power & Peripherals

Onboard Ethernet PHY, USB PHY, and PMIC reduce baseboard complexity and BOM cost. Simply supply 3.3V to 5V and connect your application peripherals.

Industrial Longevity

Industrial-grade components rated for -25°C to +85°C operation with long-term availability commitment, ensuring your product design remains in production for years.

Electrical Characteristics

ParameterMinMax
Power Supply (VIN)3.3V5.0V
I/O Voltage-3.3V
Operating Temperature-25°C+85°C

Documentation

Download the full TX93 datasheet for complete specifications, pinout details, and design guidelines.

Download Datasheet (PDF)

Payment & Security

Payment methods

  • PayPal

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TX93

€0,00
NXP i.MX93 1.5 GHz Dual Cortex®-A55
1GB LPDDR4, 4GB eMMC, 2MB NOR
-25 °C to 85 °C
68 x 26 x 4 mm
Datasheet
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