Overview
The TX8P is a SO-DIMM Computer-on-Module from Ka-Ro electronics, part of the TX Family, based on the NXP i.MX 8M Plus. In a 26mm SO-DIMM form factor, it pairs Quad Cortex-A53 cores at 1.6 GHz with a 2.3 TOPS Machine Learning Accelerator and Tensilica HiFi4 DSP, making it ideal for industrial AI, vision and audio-rich edge applications.
Key Features
Processor
NXP i.MX 8M Plus
Quad Cortex-A53 @ 1.6 GHz
Memory
2 GB LPDDR4 SDRAM
8 GB eMMC
Temperature Range
Industrial Grade
-30°C to +85°C
Form Factor
26 mm SO-DIMM
DIMM200 connector
Display & Vision
LVDS, MIPI-DSI, HDMI 2.0a
GC520L 2D + GC7000UL 3D GPU
1080p60 video de-/encode
OS Support
Linux
Ready for application development
Connectivity
Available Variants
| Feature | TX8P |
|---|---|
| Processor | NXP i.MX 8M Plus |
| Primary Core | Quad Cortex-A53 @ 1.6 GHz |
| Secondary Core | Cortex-M7 |
| RAM | 2 GB LPDDR4 |
| ROM | 8 GB eMMC |
| Display | LVDS / MIPI-DSI / HDMI 2.0a |
| GPU / NPU | GC520L 2D + GC7000UL 3D + 2.3 TOPS NPU |
| Audio DSP | Tensilica HiFi4 up to 800 MHz |
| PCIe | 1x Gen 3, 1-lane |
| Temperature | -30°C to +85°C |
Design Advantages
Pin-Compatible TXCOM Design
Standard TXCOM pinout across the TX Family enables a scalable platform strategy. Design one baseboard and migrate between processors as application requirements evolve.
Edge AI Powerhouse
2.3 TOPS Machine Learning Accelerator plus Tensilica HiFi4 DSP and Dual Camera ISP enable advanced industrial AI, vision and voice applications.
HDMI 2.0a Display
Onboard HDMI 2.0a output simplifies digital signage, KIOSK and HMI designs without external bridges.
Industrial Longevity
Industrial-grade components rated for -30°C to +85°C operation with long-term availability commitment.
Electrical Characteristics
| Parameter | Min | Max |
|---|---|---|
| Power Supply (VIN) | 3.3V | 5V |
| I/O Voltage | - | 3.3V |
| Operating Temperature | -30°C | +85°C |
Documentation
Download the full TX8P datasheet for complete specifications, pinout details, and design guidelines.
Download Datasheet (PDF)