TX8P

€0,00

Description

The QSMP series are compact, QFN-style solder-down Computer-on-Modules from Ka-Ro electronics, designed for industrial embedded applications. Key advantages include:

  • Ultra-compact QFN package with thermal pad
  • Visual solder joint inspection after assembly
  • Single-sided PCB assembly
  • QS family pin-compatible design
  • Industrial temperature range
  • 3.3V power supply
  • Linux OS support

Scroll down for detailed specifications, connectivity options, and variant information for this specific module.

Ka-Ro TX8P - System on Module

Ka-Ro TX8P

TX Family · SO-DIMM (DIMM200) · 67.6mm × 26mm × 4mm

Overview

The TX8P is a high-performance System on Module powered by the NXP i.MX 8M Plus processor with Quad Cortex-A53 cores and a dedicated Cortex-M7 co-processor. Featuring 2GB LPDDR4 memory, 8GB eMMC storage, and a 2.3 TOPS Machine Learning accelerator, the TX8P is purpose-built for vision, AI, and multimedia applications. With dual camera ISP, dual Ethernet (including Gigabit with TSN), and comprehensive display outputs including HDMI 2.0a, it delivers exceptional capability in the compact SO-DIMM DIMM200 form factor. Industrial-grade operation from −30°C to 85°C ensures reliability in demanding environments.

Key Features

i.MX 8M Plus Processor

Quad Cortex-A53 @ 1.6 GHz application cores with Cortex-M7 @ 800 MHz real-time co-processor for mixed-criticality workloads.

ML Accelerator

Integrated 2.3 TOPS Neural Processing Unit for on-device machine learning inference, plus HiFi4 DSP @ 800 MHz for audio and signal processing.

Dual Camera ISP

2x MIPI-CSI 4-lane inputs with dual camera ISP supporting 2x HD or 1x 12MP, HDR, and hardware dewarp for advanced vision applications.

Triple Display Output

LVDS, MIPI-DSI, and HDMI 2.0a display interfaces with GC520L 2D and GC7000UL 3D GPU, supporting 1080p60 video playback.

High-Speed Memory

2GB LPDDR4 RAM and 8GB eMMC onboard storage deliver the bandwidth and capacity needed for ML and multimedia workloads.

Industrial Grade

Rated for −30°C to 85°C operation with 3.3V to 5V supply, built for reliable deployment in harsh industrial environments.

Connectivity

Ethernet

2x (10/100 + Gb IEEE1588/AVB/TSN)

USB

1x USB 3.0 + 1x USB 2.0

UART

4x UART

I2C

4x I2C

SPI

3x SPI

CAN

2x CAN-FD

PCIe

Gen 3 1-lane

Camera

2x MIPI-CSI 4-lane

Storage

eMMC / SD

I/O Voltage

3.3V

Available Variants

Feature TX8P
Processor NXP i.MX 8M Plus
CPU Cores Quad Cortex-A53 @ 1.6 GHz
Co-Processor Cortex-M7 @ 800 MHz
RAM 2GB LPDDR4
Storage 8GB eMMC
GPU GC520L 2D, GC7000UL 3D
ML Accelerator 2.3 TOPS NPU
DSP HiFi4 @ 800 MHz
Display LVDS, MIPI-DSI, HDMI 2.0a
Camera 2x MIPI-CSI 4-lane, Dual ISP (2x HD / 1x 12MP, HDR, dewarp)
Ethernet 10/100 + Gigabit (IEEE1588/AVB/TSN)
OS Support Linux

Design Advantages

Pin-Compatible TXCOM

The TX8P follows the TXCOM standard, ensuring pin compatibility across the entire TX module family for seamless hardware upgrades and scalability.

Compact SO-DIMM

The DIMM200 SO-DIMM form factor (67.6mm × 26mm × 4mm) enables space-efficient integration in compact embedded designs.

Integrated Power & Peripherals

Onboard power management, memory, storage, and comprehensive peripheral interfaces reduce carrier board complexity and accelerate time-to-market.

Industrial Longevity

Built for long product lifecycles with industrial-grade components rated for −30°C to 85°C, ensuring reliable operation in demanding environments.

Electrical Characteristics

Parameter Value
Supply Voltage 3.3V to 5V
I/O Voltage 3.3V
Operating Temperature −30°C to 85°C (Industrial)
Form Factor SO-DIMM DIMM200
Dimensions 67.6mm × 26mm × 4mm
Memory 2GB LPDDR4
Storage 8GB eMMC

Documentation

Download the TX8P datasheet for full technical specifications, pinout details, and integration guidelines.

Download Datasheet (PDF)

Payment & Security

Payment methods

  • PayPal

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TX8P

€0,00
NXP i.MX 8M Plus 1.6 GHz Quad Cortex®-A53
2GB LPDDR4, 8GB eMMC
-30 °C to 85 °C
68 x 26 x 4 mm
Datasheet
View product