Overview
The QSMP-25 is the flagship QFN-style Solder-Down Computer-on-Module of the QS Family from Ka-Ro electronics. In a 29mm x 29mm x 2.6mm form factor with 1mm pitch and 108 pads, the QSMP-25 delivers the full performance of STMicroelectronics' STM32MP255F — dual-core Arm Cortex-A35 at up to 1.5 GHz alongside a Cortex-M33 real-time core at 400 MHz. With 1 GB LPDDR4, a 25.6 GFlops 3D GPU, 1.35 TOPS Vivante NPU, full H.264/VP8 encode and decode, USB 3.0/PCIe Gen 2 connectivity and the extended -40°C to +85°C industrial temperature grade, it is purpose-built for demanding edge AI, machine vision and high-performance industrial applications.
Key Features
Processor
ST STM32MP255F
2x Cortex-A35 @ 1.5 GHz
1x Cortex-M33 @ 400 MHz
Memory
1 GB LPDDR4 RAM
4 GB eMMC Flash
Temperature Range
Extended Industrial
-40°C to +85°C
Form Factor
29 x 29 x 2.6 mm
QFN-style Solder-Down
108 pads, 1mm pitch
Display, GPU & AI
LVDS Display Interface
3D GPU 25.6 GFlops, H.264 Enc/Dec
Vivante NPU 1.35 TOPS
High-Speed I/O
USB 3.0 / PCIe Gen 2
2x Gb Ethernet (RGMII)
USB Type-C support
Connectivity
Available Variants
| Feature | QSMP-25 Standard |
|---|---|
| Processor | ST STM32MP255F |
| Primary Core | 2x Cortex-A35 @ 1.5 GHz |
| Secondary Core | Cortex-M33 @ 400 MHz |
| RAM | 1 GB LPDDR4 |
| ROM | 4 GB eMMC |
| Display | LVDS (8 lanes) |
| GPU | 133 MTrg/s, 800 MPix/s, 25.6 GFlops |
| NPU / VPU | Vivante 1.35 TOPS / H.264 + VP8 Encode & Decode |
| High-Speed | USB 3.0 + USB 2.0 or PCIe Gen 2 + USB 2.0 |
| CAN | 3x CAN-FD |
| Security | Secure Boot, TrustZone, AES-128, P-256/P256 |
| Temperature | -40°C to +85°C |
Design Advantages
Top-of-Range AI & Vision
1.35 TOPS Vivante NPU plus 25.6 GFlops 3D GPU and full H.264 encode/decode — enough headroom for live multi-stream camera analytics, on-device inference and rich graphical HMIs without an external accelerator.
USB 3.0 / PCIe Gen 2
A single high-speed lane configurable as USB 3.0 SuperSpeed or PCIe Gen 2 — connect SSDs, NVMe, 5G modems, FPGAs or RF front-ends without external bridges. USB Type-C connector support is included natively.
Extended -40°C Industrial Grade
Rated for -40°C to +85°C operation across all components, suitable for harsh environments such as outdoor enclosures, transport, agriculture and unheated industrial sites where standard -25°C-rated modules would fail.
QFN-Style Solder-Down
29mm square QFN package with thermal pad and 108 pads. Single-sided assembly leaves the underside of the carrier board free, and visual solder joint inspection remains possible after soldering.
Electrical Characteristics
| Parameter | Min | Max |
|---|---|---|
| Power Supply (VIN) | 3.1V | 3.6V |
| I/O Voltage | - | 3.3V |
| Operating Temperature | -40°C | +85°C |
Documentation
Download the full QSMP-25 datasheet for complete specifications, pinout details, and design guidelines.
Download Datasheet (PDF)