SKU: QS91-3110

QS91 Solder-Down System-on-Module

Lead-time: 4 – 8 weeks

Price for 1000 pcs: €52.5 per unit

Contact us for firm quotes on alternate volumes.

NXP i.MX 91 1.4 GHz Cortex®-A55
512 MB LPDDR4, 4 GB eMMC
-25 °C to 85 °C
27 x 27 x 2.6 mm
Datasheet

Overview

The QS91 is a compact QFN solder-down Computer-on-Module from Ka-Ro electronics, part of the QS Family. Measuring just 27mm x 27mm with only 2.6mm total height, the QS91 is built around the NXP i.MX 91 with a single Cortex-A55 core running at 1.4 GHz and NXP's EdgeLock secure enclave. With 512MB LPDDR4 RAM, 4GB eMMC, and a rich peripheral set including dual CAN-FD, Ethernet, and up to 60 GPIOs, the QS91 is ideally suited for cost-sensitive industrial IoT gateways, secure edge devices, and connected sensor platforms where security, low power, and small size are paramount.

NXP i.MX 91 Cortex-A55 @ 1.4 GHz 27mm x 27mm QFN Industrial -25°C to 85°C EdgeLock Secure Enclave Linux

Key Features

Processor

NXP i.MX 91
1x Cortex-A55 @ 1.4 GHz
EdgeLock Secure Enclave

Memory

512MB LPDDR4 RAM
4GB eMMC Flash

Temperature Range

Industrial Grade
-25°C to +85°C

Form Factor

27 x 27 x 2.6 mm
QFN (100 pads, 1mm pitch)

Display

RGB Display Interface
No GPU (cost-optimised)

Security

NXP EdgeLock Secure Enclave
Tamper Detection
Secure Boot

Connectivity

Ethernet (RGMII)
USB 2.0 (x2)
CAN-FD (x2)
UART (x8)
I2C (x7) / SPI (x8)
eMMC / SD
PWM / SAI Audio
ADC (4-ch, 12-bit)
2x FlexIO
Up to 60x GPIO
RGB Display
Tamper Detection

Available Variants

Feature QS91 QSRZ QSMP-15 QSMP-13
ProcessorNXP i.MX 91Renesas RZ/G2LSTM32MP157CSTM32MP135C
Primary CoreCortex-A55 @ 1.4 GHz2x Cortex-A55 @ 1.2 GHz2x Cortex-A7 @ 650 MHzCortex-A7 @ 650 MHz
Secondary CoreCortex-M33 @ 200 MHzCortex-M4 @ 200 MHz
RAM512MB LPDDR4512MB / 1GB DDR3L256MB / 512MB DDR3L256MB DDR3L
ROM4GB eMMC4GB eMMC4GB eMMC4GB eMMC
DisplayRGBRGB + MIPI DSIRGB + MIPI DSIRGB
GPUMali-G31Yes
Temperature-25°C to +85°C-40°C to +85°C-25°C to +85°C-25°C to +85°C

Design Advantages

Solder-Down Design

QFN form factor eliminates connectors and mechanical fasteners. The 100-pad layout at 1mm pitch provides a robust, vibration-resistant connection suitable for harsh industrial environments.

Easy PCB Integration

The compact 27mm x 27mm footprint with standard 1mm pitch pads allows integration onto carrier boards using conventional PCB design tools. Even 2-layer boards can be used for simple applications.

Hardware Security

NXP EdgeLock secure enclave provides hardware root of trust, secure boot, and tamper detection — essential for industrial IoT devices requiring strong security without external security ICs.

QS Pin-Compatible

Standard 27mm QS pinout ensures compatibility across the QS family. Design one baseboard and scale between processors as application requirements evolve.

Electrical Characteristics

Parameter Value
Power Supply3.3V
I/O Voltage3.3V
Operating Temperature-25°C to +85°C (Industrial)
PackageQFN, 27mm x 27mm, 2.6mm height
Pad Count100 pads + thermal pad
Pad Pitch1mm

Documentation

Download the full QS91 datasheet for complete specifications, pinout details, and design guidelines.

Download Datasheet (PDF)
QS91 Solder-Down System-on-Module
Ka-Ro Electronics

QS91 Solder-Down System-on-Module

€52,50

Lead-time: 4 – 8 weeks

Price for 1000 pcs: €52.5 per unit

Contact us for firm quotes on alternate volumes.

NXP i.MX 91 1.4 GHz Cortex®-A55
512 MB LPDDR4, 4 GB eMMC
-25 °C to 85 °C
27 x 27 x 2.6 mm
Datasheet
View product