Overview
QS95
The QS95 is a compact QFN solder-down system-on-module from Ka-Ro's QS-Series, measuring just 29mm x 29mm with a total height of 4mm. Built around the powerful NXP i.MX 95 processor featuring six Cortex-A55 cores at 1.8 GHz, a Cortex-M7 at 800 MHz, and a Cortex-M33 co-processor, the QS95 delivers exceptional compute density in a tiny footprint. With 2GB RAM, 4GB eMMC, advanced GPU and NPU capabilities, dual Gigabit Ethernet, and a rich peripheral set, it is ideal for industrial vision, edge AI, and embedded HMI applications. The 108-pad QFN package with 1mm pitch enables straightforward PCB integration using standard reflow soldering.
Key Features
High-Performance Processor
NXP i.MX 95 with 6x Cortex-A55 cores at 1.8 GHz, Cortex-M7 at 800 MHz, and Cortex-M33 co-processor for real-time and security tasks.
Advanced GPU & Display
Arm Mali G310 3D GPU (OpenGL ES 3.2, Vulkan 1.2, OpenCL 3.0) with enhanced separate 2D GPU. MIPI-DSI 4-lane output, 4K60P H.264/H.265 encode or decode.
Vision & Machine Learning
2 TOPS eIQ Neutron NPU for edge AI inference. NXP ISP with RGB-IR support at 500 Mpx/sec. Dual camera inputs: 1x 4-lane CSI + 1x 4-lane CSI/DSI combo.
Memory & Storage
2GB RAM and 4GB eMMC on-module. Additional eMMC/SD interface available for expanded storage options.
Ultra-Compact Form Factor
29mm x 29mm QFN package with only 4mm total height. 108 pads at 1mm pitch for easy solder-down integration on standard PCBs.
Industrial Grade
5V power supply input. Industrial temperature range from -25°C to 85°C. Linux OS support. 3.3V I/O levels for straightforward interfacing.
Connectivity
Available Variants
| Feature | QSXP | QS95 |
|---|---|---|
| Processor | NXP i.MX 8M Plus | NXP i.MX 95 |
| CPU Cores | 4x Cortex-A53 @ 1.6 GHz | 6x Cortex-A55 @ 1.8 GHz |
| Co-Processors | Cortex-M7 @ 800 MHz | Cortex-M7 @ 800 MHz + Cortex-M33 |
| RAM | 2GB | 2GB |
| eMMC | 8GB | 4GB |
| 3D GPU | GC7000UL | Arm Mali G310 |
| 2D GPU | GC520L | Enhanced Separate 2D GPU |
| AI / ML | 2.3 TOPS + HiFi4 DSP | 2 TOPS Neutron NPU |
| Video | 1080p60 | 4K60P H.264/H.265 |
| Ethernet | 1x 1Gb Ethernet | 2x 1Gb Ethernet |
Design Advantages
Solder-Down Design
QFN form factor eliminates connectors and mechanical fasteners. The 108-pad layout at 1mm pitch provides a robust, vibration-resistant connection suitable for harsh industrial environments.
Easy PCB Integration
The compact 29mm x 29mm footprint with standard 1mm pitch pads allows integration onto carrier boards using conventional PCB design tools and manufacturing processes.
EMI Performance
The solder-down QFN package with its low 4mm profile minimises electromagnetic interference, making it easier to meet EMC compliance requirements without extensive shielding.
Industrial Reflow Compatible
Designed for standard lead-free reflow soldering processes. The QFN package can be placed and soldered alongside other SMD components in a single production pass.
Electrical Characteristics
| Parameter | Value |
|---|---|
| Supply Voltage | 5V |
| I/O Voltage | 3.3V |
| Operating Temperature | -25°C to 85°C (Industrial) |
| Package | QFN, 29mm x 29mm, 4mm height |
| Pad Count | 108 pads |
| Pad Pitch | 1mm |
Documentation
QS95 Datasheet
Download the full datasheet for detailed specifications, pin assignments, and integration guidelines.
Download Datasheet (PDF)