Overview
The QSMP-23 is a QFN-style Solder-Down Computer-on-Module from Ka-Ro electronics, part of the QS Family. In a compact 27mm x 27mm x 2.6mm form factor with 1mm pitch and 100 pads, the QSMP-23 delivers dual-core Arm Cortex-A35 processing at 1.2 GHz from STMicroelectronics' STM32MP235 alongside a Cortex-M33 real-time core at 400 MHz. With 1 GB LPDDR4, an integrated GPU, 0.6 TOPS Vivante NPU, H.264/VP8 video decoder and the extended -40°C to +85°C industrial temperature grade, it is purpose-built for harsh-environment industrial control, edge AI vision and outdoor IoT applications.
Key Features
Processor
ST STM32MP235
2x Cortex-A35 @ 1.2 GHz
1x Cortex-M33 @ 400 MHz
Memory
1 GB LPDDR4 RAM
4 GB eMMC Flash
Temperature Range
Extended Industrial
-40°C to +85°C
Form Factor
27 x 27 x 2.6 mm
QFN-style Solder-Down
100 pads, 1mm pitch
Display, GPU & AI
LVDS Display Interface
3D GPU 12.8 GFlops, 1080p60 VPU
Vivante NPU 0.6 TOPS
OS Support
Linux
Ready for application development
Connectivity
Available Variants
| Feature | QSMP-23 Standard |
|---|---|
| Processor | ST STM32MP235 |
| Primary Core | 2x Cortex-A35 @ 1.2 GHz |
| Secondary Core | Cortex-M33 @ 400 MHz |
| RAM | 1 GB LPDDR4 |
| ROM | 4 GB eMMC |
| Display | LVDS |
| GPU | 66 MTrg/s, 400 MPix/s, 12.8 GFlops |
| NPU / VPU | Vivante 0.6 TOPS / H.264 + VP8 Decode |
| CAN | 2x CAN-FD |
| Security | Secure Boot, TrustZone, AES-128, P-256/P256 |
| Temperature | -40°C to +85°C |
Design Advantages
Extended -40°C Industrial Grade
Rated for -40°C to +85°C operation across all components, suitable for harsh environments such as outdoor enclosures, transport, agriculture and unheated industrial sites where standard -25°C-rated modules would fail.
QFN-Style Solder-Down
Compact 27mm square QFN package with thermal pad. Single-sided assembly leaves the underside of the carrier board free, and visual solder joint inspection remains possible after soldering.
Edge AI & Vision Ready
Integrated 0.6 TOPS Vivante NPU with 1 GB LPDDR4, MIPI-CSI camera input and LVDS display output — a complete vision pipeline on a 27mm module without external accelerators.
Defined Return Path
A large ground pad on the bottom side provides a defined ground plane connection for all signals, minimising EMI and supporting cost-effective 2-layer baseboard designs at controlled impedance.
Electrical Characteristics
| Parameter | Min | Max |
|---|---|---|
| Power Supply (VIN) | 3.1V | 3.6V |
| I/O Voltage | - | 3.3V |
| Operating Temperature | -40°C | +85°C |
Documentation
Download the full QSMP-23 datasheet for complete specifications, pinout details, and design guidelines.
Download Datasheet (PDF)