Overview
The QSMP-15 is a QFN-style Solder-Down Computer-on-Module from Ka-Ro electronics, part of the QS Family. In a compact 27mm x 27mm x 2.3mm form factor with 1mm pitch and 100 pads, the QSMP-15 pairs STMicroelectronics' STM32MP157 dual-core Arm Cortex-A7 application processor at 650 MHz with a Cortex-M4 real-time co-processor and a Vivante 3D GPU. Optional Wi-Fi/Bluetooth on-module make it ideal for cost-sensitive industrial HMI, IoT gateways and connected control applications running mainline Linux.
Key Features
Processor
ST STM32MP157
2x Cortex-A7 @ 650 MHz
1x Cortex-M4 @ 209 MHz
Memory
512 MB DDR3L RAM
(256 MB option)
4 GB eMMC Flash
Temperature Range
Industrial Grade
-25°C to +85°C (E85)
(Optional -40°C to +85°C)
Form Factor
27 x 27 x 2.3 mm
QFN-style Solder-Down
100 pads, 1mm pitch
Display & GPU
24-bit RGB + 2-lane MIPI-DSI
Vivante 3D GPU
OpenGL ES 2.0
Wireless (Optional)
Wi-Fi 802.11a/b/g/n/ac
Dual-band 2.4 / 5 GHz
Bluetooth 5.2 BR/EDR/LE
Connectivity
Available Variants
QSMP-15 (STM32MP157C) — compare order codes side-by-side:
| Part Number | QSMP-1570 | QSMP-1570W | QSMP-1530C |
|---|---|---|---|
| Part Name | QSMP/157C/512S/4GF/E85 | QSMP/157C/512S/4GF/WLAN/I | QSMP/157C/256S/4GF/E85 |
| Processor | STM32MP157C | STM32MP157C | STM32MP157C |
| SDRAM | 512 MiB | 512 MiB | 256 MiB |
| Flash | 4 GB eMMC | 4 GB eMMC | 4 GB eMMC |
| Display-IF | 24-bit RGB + 2-lane MIPI-DSI | 24-bit RGB + 2-lane MIPI-DSI | 24-bit RGB + 2-lane MIPI-DSI |
| Wireless | — | WiFi + Bluetooth | — |
| Temperature | -25°C to +85°C | -40°C to +85°C | -25°C to +85°C |
Design Advantages
QFN-Style Solder-Down
Compact 27mm square QFN package with thermal pad. Single-sided assembly leaves the underside of the carrier board free, and visual solder joint inspection remains possible after soldering.
QSMP-20 Upgrade Path
QSMP-15 is pin-compatible with the QSMP-20 (Cortex-A35 + GPU + NPU). Start with the QSMP-15 for cost-optimised designs, then drop in QSMP-20 on the same baseboard when more compute or AI capability is needed.
Defined Return Path
A large ground pad on the bottom side provides a defined ground plane connection for all signals, minimising EMI and supporting cost-effective 2-layer baseboard designs at controlled impedance.
Industrial Reflow Compatible
Compatible with industrial standard reflow profile for Pb-free solders. Standard contact assignments, single-sided assembly and segmented ground pad solder mask for reliable self-aligning joints.
Electrical Characteristics
| Parameter | Min | Max |
|---|---|---|
| Power Supply (VIN) | 3.1V | 3.6V |
| I/O Voltage | - | 3.3V |
| Operating Temperature | -25°C | +85°C |
Documentation
Download the full QSMP-15 datasheet for complete specifications, pinout details, and design guidelines.
Download Datasheet (PDF)