SKU: QS93-5210

QS93 Solder-Down System-on-Module

Lead-time: 4 – 8 weeks

Price for 1000 pcs: €67 per unit

Contact us for firm quotes on alternate volumes.

NXP i.MX93 1.5 GHz Dual Cortex®-A55
1GB LPDDR4, 4GB eMMC
-40 °C to 85 °C
27 x 27 x 2.7 mm
Datasheet

Overview

The QS93 is a QFN-style Solder-Down Computer-on-Module from Ka-Ro electronics, part of the QS Family. In a compact 27mm x 27mm x 2.6mm form factor with 1mm pitch and 100 pads, the QS93 delivers dual-core Arm Cortex-A55 processing at 1.5 GHz alongside a Cortex-M33 real-time core, making it ideal for industrial IoT, edge AI, and vision applications. The module features NXP's i.MX 93 processor with an integrated Arm Ethos U-65 microNPU for machine learning inference at the edge, plus the EdgeLock secure enclave for hardware-rooted security.

Key Features

Processor

NXP i.MX 9352
2x Cortex-A55 @ 1.5 GHz
1x Cortex-M33 @ 250 MHz

Memory

1GB LPDDR4 RAM
4GB eMMC Flash

Temperature Range

Industrial Grade
-40°C to +85°C

Form Factor

27 x 27 x 2.6 mm
QFN-style Solder-Down
100 pads, 1mm pitch

Display & Vision

LVDS Display Interface
2D GPU, MIPI-CSI (2-lane)
Arm Ethos U-65 microNPU

OS Support

Linux
Ready for application development

Connectivity

2x Gb Ethernet
2x USB 2.0
2x FlexCAN
5x UART
7x I²C / 4x SPI
SAI Audio
eMMC / SD Card
MIPI-CSI Camera

Available Variants

FeatureQS93
ProcessorNXP i.MX 9352
Primary Core2x Cortex-A55 @ 1.5 GHz
Secondary Core1x Cortex-M33 @ 250 MHz
RAM1 GB LPDDR4
ROM4 GB eMMC
DisplayLVDS
GPU / NPU2D GPU + Arm Ethos U-65 microNPU
CAN2x FlexCAN
SecurityNXP EdgeLock Secure Enclave
Temperature-40°C to +85°C

Design Advantages

QFN-Style Solder-Down

Compact 27mm square QFN package with thermal pad. Single-sided assembly leaves the underside of the carrier board free, and visual solder joint inspection remains possible after soldering.

QS Family Pin-Compatible

Standard QS pinout across the QS Family enables a scalable platform strategy. Design one baseboard and migrate between processors as application requirements evolve.

Defined Return Path

A large ground pad on the bottom side provides a defined ground plane connection for all signals, minimising EMI and supporting cost-effective 2-layer baseboard designs.

Industrial Longevity

Industrial-grade components rated for -40°C to +85°C operation with long-term availability commitment, ensuring your product design remains in production for years.

Electrical Characteristics

ParameterMinMax
Power Supply (VIN)3.3V3.3V
I/O Voltage-3.3V
Operating Temperature-40°C+85°C

Documentation

Download the full QS93 datasheet for complete specifications, pinout details, and design guidelines.

Download Datasheet (PDF)
QS93 Solder-Down System-on-Module
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QS93 Solder-Down System-on-Module

€67,00

Lead-time: 4 – 8 weeks

Price for 1000 pcs: €67 per unit

Contact us for firm quotes on alternate volumes.

NXP i.MX93 1.5 GHz Dual Cortex®-A55
1GB LPDDR4, 4GB eMMC
-40 °C to 85 °C
27 x 27 x 2.7 mm
Datasheet
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