Overview
The QSMP-20 is a QFN-style Solder-Down Computer-on-Module from Ka-Ro electronics, part of the QS Family. In a compact 27mm x 27mm x 2.6mm form factor with 1mm pitch and 100 pads, the QSMP-20 delivers dual-core Arm Cortex-A35 processing at 1.2 GHz from STMicroelectronics' STM32MP235 alongside a Cortex-M33 real-time core at 400 MHz. With an integrated GPU, 0.6 TOPS NPU and H.264/VP8 video decoder, it is a drop-in pin-compatible upgrade for the QSMP-15, ideal for industrial HMI, edge AI and vision applications that need more compute headroom on the same baseboard.
Key Features
Processor
ST STM32MP235C
2x Cortex-A35 @ 1.2 GHz
1x Cortex-M33 @ 400 MHz
Memory
512 MB DDR3L RAM
4 GB eMMC Flash
Temperature Range
Industrial Grade
-25°C to +85°C
(Optional -40°C to +85°C)
Form Factor
27 x 27 x 2.6 mm
QFN-style Solder-Down
100 pads, 1mm pitch
Display, GPU & AI
24-bit RGB + 2-lane MIPI-DSI
3D GPU 12.8 GFlops, 1080p60 VPU
NPU 0.6 TOPS
OS Support
Linux
Ready for application development
Connectivity
Available Variants
| Feature | QSMP-20 Standard | Custom Options |
|---|---|---|
| Processor | ST STM32MP235C | MP21x / MP23x / MP25x |
| Primary Core | 2x Cortex-A35 @ 1.2 GHz | Up to 2x A35 @ 1.5 GHz |
| Secondary Core | Cortex-M33 @ 400 MHz | Optional Cortex-M0+ |
| RAM | 512 MB DDR3L | 256 MB or 1 GB |
| ROM | 4 GB eMMC | 8 GB eMMC |
| Display | 24-bit RGB + MIPI-DSI | RGB only |
| GPU / NPU / VPU | 12.8 GFlops + 0.6 TOPS + Decode | Optional / not fitted |
| CAN | 3x CAN-FD / TTCAN | |
| Security | Secure Boot, TrustZone, AES-256/192/128, SHA-512/SHA-3, HMAC, RNG | |
| Temperature | -25°C to +85°C | -40°C to +85°C |
| Order Code | QSMP/235C/512S/4GF/E85 | Configure with sales |
Design Advantages
QFN-Style Solder-Down
Compact 27mm square QFN package with thermal pad. Single-sided assembly leaves the underside of the carrier board free, and visual solder joint inspection remains possible after soldering.
Drop-In QSMP-15 Upgrade
Pin-compatible with the QSMP-15 baseboard. Migrate from a Cortex-A7 platform to a Cortex-A35 platform with integrated GPU, NPU and H.264 video — without redesigning your carrier — for a major step up in compute and AI capability.
Defined Return Path
A large ground pad on the bottom side provides a defined ground plane connection for all signals, minimising EMI and supporting cost-effective 2-layer baseboard designs at controlled impedance.
Industrial Reflow Compatible
Compatible with industrial standard reflow profile for Pb-free solders. Standard contact assignments, single-sided assembly and segmented ground pad solder mask for reliable self-aligning joints.
Electrical Characteristics
| Parameter | Min | Max |
|---|---|---|
| Power Supply (VIN) | 3.1V | 3.6V |
| I/O Voltage | - | 3.3V |
| Operating Temperature | -25°C | +85°C |
Documentation
Download the full QSMP-20 datasheet for complete specifications, pinout details, and design guidelines.
Download Datasheet (PDF)